Dipping advantage of hot melting glue

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Dipping advantage of hot melting glue

PUR hot melting glue is a single -component hot -melt structure glue. It is exposed to the air in the air to solidify. After the glue is completely solidified, it not only has good adhesion strength, but also has the resistance to impact. It also has resistance to resistance. The characteristics of warmth, corrosion resistance and aging resistance have become the first choice for adhesive products in the electronics industry.

When PUR hot -melt glue, heating to a certain temperature has a good fluidity, and it is very convenient to order. Because of the characteristics of high -intensity adhesion for PUR hot melting glue, it meets the adhesion requirements of the structural components of most electronic products. PUR hot melting glue has strong adhesion and high strength, which can meet the adhesion requirements of most electronic products. PUR hot melting glue is easier to control thickness and width than many glue to process the glue machine, which can basically meet the process requirements on the market. PUR hot melting glue is a thermoplastic polyurethane. After processing with PUR hot -melt glue, it is easier to clean up the machine and products.

The characteristics of hot melting glue determine that the hot melting glue has outstanding advantages in the adhesion of the product in the electronics field when using the point glue processing.

Product Recommendation: best glue hot melt adhesive