Semiconductor chip commonly used failure analysis method

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North Soft Fack Analysis Zhao Gong

Semiconductor engineer

2021-12-17 10:11

Microscope analysis om

Inspermail test: Zeiss

Golden Xianxian microscope om

Service introduction: It can be used to observe the surface shape, size, structure, defect, etc. of the appearance and failure of the device. The Jinxiangxian microscope system is combined with the traditional optical microscope with the computer (digital camera) through the optoelectronics conversion. It can not only make microfinance on the eyepiece, but also observe real -time dynamic images on the computer (digital camera) display screen , Computer -type golden display microscope and can edit, save and print the required pictures.

Scope of service: available for research units, metallurgy, machinery manufacturing factories, and higher industrial colleges

The study of the study and thermal treatment, metal physics, steelmaking, and casting process for gold phase test research

半导体芯片常用失效分析方法

Service content: 1. Sample appearance and appearance detection

2. Gold Micro Analysis of the Sample Sample

3. Find a variety of defects

Sports Vision Microscope OM Non -destructive Test: Zeiss

Service introduction: Terminal microscope, also known as physical microscope or anatomical mirror. It is a visual instrument with a regular -dimensional sense, observing objects from different angles, so that the eyes are microscopy with three -dimensional sensation. You do n’t need to be processed to observe the body. Put it directly under the lens to cooperate with the lighting to observe. The imaging is upright, which is convenient for operation and anatomy. The diameter of the field is large, but the observation is required to put it

The large magnification is less than 200 times.

Scope of service: Electronic precision component assembly and maintenance, quality control, cultural relics, stamps of the textile industry

Auxiliary identification and various material surface observations

2. Observation and analysis of samples

3. Check the check analysis after the cap

4. Crystal tube point welding and inspection

X -ray

Inspermail test: Germany Yiguanlang

半导体芯片常用失效分析方法

Service introduction: X-RAY uses cathode ray tubes to generate high-energy electronics and metal target impacts. During the impact, due to the sudden deceleration of the electrons, the losses of the kinetic energy will be released in X-ray. For the position where the sample cannot be observed in appearance, the changes in the strength of the light after penetrating different density substances are used to penetrate the different density substances. Observe the area where there are problems to be tested in the measuring object.

Service scope: product research and development, sample trial production, failure analysis, process monitoring and large -scale product observation

Service content: 1. Observe DIP, SOP, QFP, QFN, BGA, FLIPCHIP and other packaging semiconductors, resistors, capacitors and other electronic components, as well as small PCB printing circuit boards

2. Observe the size, quantity, stacking DIE, and line of the internal chip of the device

3. Observation chip CRACK, Unexplained, disconnected, wiring, internal air bubbles and other packaging defects, as well as welding balls cold welding, virtual welding and other welding defects

C-SAM (ultrasonic scanning microscope)

, Decent inspection: SONIX

1. The lattice structure inside the material, impurities particles. Mixed objects. Precipitate. 2. Internal cracks. 3. Layout defects .4. Empty, bubbles, gaps, etc.

I/V Curve

Advanced Smart-1

Service introduction: Verification and measurement of electrical, parameters and characteristics of semiconductor electronic components. Such as voltage-current. In the integrated circuit failure analysis process, I/V Curve’s quantitative measurement is often the second step of non -destructive analysis (the appearance inspection is ranked first), which shows the importance of the CURVE quantity test.

Service scope: packaging test plant, SMT field, etc.

Service content: 1.OPEN/short Test

2.I/V Curve Analysis

3.idd measuring

4. Powered Leakage

SEM scan electron microscope/EDX energy scattered X -ray instrument

(Material structure analysis/defect observation, element composition of conventional micro -level analysis, accurately measure component size)

Scan electron microscope (SEM)

半导体芯片常用失效分析方法

Service introduction: SEM/EDX (appearance observation, composition analysis) scanning electron microscope (SEM) can directly use the material performance of the sample surface material for micro imaging. EDX is implemented by analyzing the element characteristics of the element characteristics emitted by the sample. The element contained in the sample is measured according to the different elemental characteristics of the X -ray wavelength. By comparing the strength of different elemental spectrum lines, the content of the element in the sample can be measured. Usually EDX combined with electronic microscope (SEM), which can analyze the microcontrolly component of the sample.

Scope of service: military industry, aerospace, semiconductor, advanced materials, etc.

Service content: 1. Material surface appearance analysis, micro -zone appearance observation

2. Analysis of material shape, size, surface, section, particle size distribution

3. Film sample surface morphological observation, film roughness and film thick analysis

4. Nano size measurement and label

5. Micro -zone composition qualitative and quantitative analysis

Emmi microscope

Advanced P-100

Common leakage current path analysis methods to find hot spots,

Emission microscope (Emmi)

Service introduction: For fault analysis, Emission Microscope (Emmi) is a very useful and highly efficient analysis tool. Mainly detect photons from the IC. In IC components, EHP (Electron Hole Pairs) Recombination will release photons. If the P-N knot is added with partial pressure, the electrons of the N-trap at this time can easily spread to the P trap, and the acupuncture point of P can easily spread to N, and then do EHP Recombination with the holes (or N-terminal electrons) on the P-end.

Service scope: fault point positioning, looking for near -infrared band glowing point

Service content: 1.P-n connector leakage; P-N connector collapse

2. Thermal electrons of the crystal pipe of saturated zone

3. The torment of photons generated by the illegitimate leakage current

4.latch Up, Gate Oxide Defect, Junction Leakage, Hot Carriers Effect, ESD and other issues

Probe Station

Probe

test

Advanced PW-800

Service introduction: The probe desk is mainly used in the semiconductor industry and the photoelectric industry. Tests for integrated circuits and packaging. The research and development of precision electrical measurement of complex, high -speed devices is designed to ensure quality and reliability, and reduce the cost of research and development time and device manufacturing process.

Service scope: WAFER, IC test, IC design, etc. within 8 inches

FIB line modification

Fei Scios 2 Dualbeam

Cut the line connection, cut point observation, TEM sample, precision thickness measurement, etc.

Focus on ion beam, Focused Ion Beam

Service introduction: FIB (Focusing ion beam, Focused Ion Beam) is the ion beam generated by the liquid metal ion source accelerated by ion gun, which is shot on the surface of the sample to generate a secondary electronic signal to obtain the electronic image. Similar microscope) Similar, or with a strong current ion beam, the surface atoms are peeled to complete the micro -and nano -level surface appearance processing.

Scope of service: research and theoretical materials research, semiconductor, data storage, natural resources and other fields

Service content: 1. chip circuit modification and layout verification

2. Cross-section section analysis

3.PROBING PAD

4. Fixed -point cutting

ESD/LATCH-Up

Static discharge

/闩 Locking effectiveness test (some customers conduct these two reliable tests before the chip flows into the client, and some customers have thought of sieved the films after the failure). These common methods have been mentioned. There are some necessary sample processing processes before the failure analysis.

Pick

DIE

Remove the plastic seal with acid method and leak out

Decap (Kaifeng, Open Hat)

Advanced PST-20000

半导体芯片常用失效分析方法

The chip opening machine DECAP is mainly used for chip opening verification SAM and XRAY.

Service introduction: DECAP is Kaifeng, also known as opening cover, opening hat, and refers to local corrosion to the complete packaging IC, so that the IC can be exposed, while maintaining the completeness of the chip function. Frame is not damaged. Prepare for the next chip failure analysis experiment to facilitate observation or other tests (such as FIB, EMMI), the function is normal after decap.

Service scope: chip opening, epoxy resin removal, IGBT silicone removal, thin sample cut

Service content: 1.ic Kaifeng (front/back) QFP, QFN, SOT, to, DIP, BGA, COB, etc.

2. Sample reduction (except ceramics, except metal)

3. Laser marking

Chemical Kaifeng Acid Decap

Service introduction: ACID Decap, also known as chemical opening, is a chemical method, that is, concentrated sulfuric acid and smoke nitric acid to remove plastic feces. Plastics covered by acid corrosion chip can expose any chip in any kind of plastic IC packaging. The process of removing plastic is fast and safe, and the surface of a clean and non -corrosive chip is produced.

Service scope: Analysis of the hat analysis of conventional plastic sealing devices includes copper wire opening

Service content: 1. chip opening (front/back)

2. IC etching, plastic seal removal

Cutting sample

Service introduction: You can preset the program to position and cut various materials of different sizes, which can automatically automatically cut materials to improve the sample production. Its micro -treatment system can adjust the cutting distance, strength, sample input ratio and automatic knife ratio of the step motor according to the material, thickness, etc. of the material. Service scope: various materials, various thickness sample cutting

Service content: 1. Obtain the standard cut of the sample through the sample cold buried injection

2. Precision cutting of small samples

半导体芯片常用失效分析方法

Grind

RIE

Service introduction: RIE is a type of dry etching. The principle of this etching is that when the tablet electrode is applied between 10 to 100MHz, a high -frequency voltage (RF, Radio Frequency) will produce hundreds of microne -thick ion layers (ION ION (ION) Sheath), put the sample in it, the ionic high -speed impact of the sample to complete the chemical reaction etching, which is RIE (Reactive Ion Etching).

Scope of service: semiconductor, material chemistry, etc.

Service content: 1. Used to etch on the same sex and the opposite sex of the ingredients using fluoromic chemistry, including carbon, epoxy resin, graphite, molten, molybdenum, nitrogen oxide, light resistance, polyanamide, polyimide, , Quartz, silicon, oxide, nitride, pyrine, nitride, titanium nitride, tungsten titanium, and tungsten device surface graphics

Automatic grinding machine

Service introduction: It is suitable for semi -automatic preparation of processing grinding polishing, modular preparation, parallel polishing, accurate angle polishing, and several methods of high -precision micro (light mirror, SEM, TEM, AFM, ETC) sample.

Service scope: It is mainly used in the failure analysis of semiconductor components, IC reverse

Service content: 1. Fine grinding and polishing section

2. Chip process analysis

3. Find the failure point

Service introduction: You can preset the program to position and cut various materials of different sizes, which can automatically automatically cut materials to improve the sample production. Its micro -treatment system can adjust the cutting distance, strength, sample input ratio and automatic knife ratio of the step motor according to the material, thickness, etc. of the material.

Service scope: various materials, various thickness sample cutting

Go to the Golden Globe DE-Gold Bump, go to the layer, dye, etc. Some also require the corresponding instrument table. SEM can view DIE surface, SAM and X-Ray observe the internal situation of the packaging and layer failure.

In addition to commonly used methods, there are other failed analysis methods, atomic power display microscope AFM, secondary ion mass spectrometry sims, flight time mass spectrum tof -sims, transmitted electron microscope TEM, field launch electron microscope, field launch scanning Russian probe, X -ray electronic energy spectrum XPS, L-I-V test system, energy loss X-ray micro-analysis system and many other means, but these projects are not very commonly used.

Chip failure analysis step

1. Non-destructive analysis: Mainly ultrasonic scanning microscopes (C-SAM)-see if there are any delay, xray-look at the internal structure, etc.

2. Electricity test: main tools, multimeter, oscilloscope, Sony Tek370A

3. Destruction analysis: mechanical DECAP,

Chemical

半导体芯片常用失效分析方法

Decap chip

Opening machine

Analysis of the failure of semiconductor device chips

Internal analysis of chip, analysis of pore air bubble failure

半导体芯片常用失效分析方法

半导体芯片常用失效分析方法

Service content: 1. Sample appearance and appearance detection

DIE

Service content: 1. Obtain the standard cut of the sample through the sample cold buried injection

2. Precision cutting of small samples